2.0 Schematic =link= - La-e801p Rev

The "LA-E801P" is the board number (PCB code) for a series of motherboards used in several HP laptop models, including the , HP 250 G6 , and HP 240 G6 lines, from around 2017 onwards. Specifically, the versions include CSL50 and CSL52 . Understanding the "REV 2.0" designation is crucial, as it signifies a specific revision of the board, and earlier versions (like REV 1.0) have different schematics.

Integrated directly onto the CPU die (System-on-Chip design). 2. Primary Power Rails & Voltage Distribution

Support for M.2 NVMe/SATA SSDs alongside a standard SATA 2.5-inch drive interface. la-e801p rev 2.0 schematic

Here's a sample post you can use as a starting point:

The is a highly sought-after technical manual used by component-level technicians to diagnose and repair hardware failures on popular 15-inch HP 15-BS series notebooks and HP 250 G6 business laptops. This motherboard—engineered by Compal under the code names CSL50 and CSL52—features a highly integrated architecture supporting Intel 6th and 7th Generation Core processors alongside advanced DDR4 system memory. Understanding its precise power sequences, rails, and pinouts is critical for troubleshooting common circuit board issues like a completely "dead" device, failing power state handshakes, or absent display backlights. Motherboard Technical Specifications The "LA-E801P" is the board number (PCB code)

Use the alphanumeric coordinates along the borders of the schematic pages to quickly track down companion components or cross-references across different sheets of the document.

: 30-pin or 40-pin eDP (embedded DisplayPort) connector supporting Full HD (1920x1080) touch panels. Integrated directly onto the CPU die (System-on-Chip design)

Activated during the S3 (Suspend to RAM) state or during the transition to the S0 (fully operational) state. +VCC_CORE and +VCC_GT (CPU Core & Graphics Power)